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Nowadays, Wi-Fi devices are ubiquitous in our lives. Casually open the home wireless routing management interface, there may be no less than 10 Wi-Fi devices online at the same time. The increase in the number of devices leads to network congestion, performance degradation, increased delay and other problems. These problems became more serious in the era of Wi-Fi 5 (802.11 ac). Therefore, when designing Wi-Fi 6 (802.11 ax), experts made improvements and innovations specifically for the problem of network congestion. So, what new technologies does Wi-Fi 6 use to improve wireless channel capacity? When the user equipment receives the AP signal, it will compare whether the color it receives is consistent with the current associated AP color. When the color is the same, the user will think that the signal is the signal in the cell. If the color of the received signal is different from that of the associated AP, the user determines that the signal belongs to the interference signal. As shown in the following figure, due to the use of different color codes, the channel 1 of the green cell is no longer interfered by the adjacent cell channel 1 (blue and red).

Then, as demand for cars picks up in the fall of 2020, Toyota Denso Renesa plans to order 28nm semiconductors from TSMC again, but there is no room to produce in-car semiconductors because TSMC lines are occupied by other semiconductors. Although the inventory in the autumn and winter of 2020 exceeded the limit, by 2021, inventory had bottomed out, coupled with the shortage of 28nm semiconductors, cars could not be made. 28nm is the last generation of planar transistors (FinFET from 16 / 14nm to 3D) (2) do not use self-aligned double pattern (SADP) (will use SADP from FinFET) (3) Renesas vertical integration (integrated equipment manufacturer IDM), for example, outsource production to FinFET from this generation. In short, 28nm semiconductors produced by TSMC and other contract factories have a good performance-to-price ratio, so many electronic devices, including automobiles, use this semiconductor. At the invitation of the Japanese government, the TSMC Kumamoto plant, which will begin operation in 2024, will also mainly produce such 28nm semiconductors.

The basic content of SoC definition is mainly in two aspects: one is its composition, and the other is its formation process. The composition of the system-level chip can be a system-level chip control logic module, a microprocessor/microcontroller CPU core module, a digital signal processor DSP module, an embedded memory module, and an interface module for external communication, and an ADC/DAC module. Analog front-end modules, power supply, and power management modules, for a wireless SoC there are also RF front-end modules, user-defined logic (which can be implemented by FPGA or ASIC), and micro-electromechanical modules, and more importantly, an SoC chip with embedded Basic software (RDOS or COS and other application software) modules or loadable user software, etc. The system-on-chip formation or generation process includes the following three aspects.

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